A memory chip is a small electronic integrated circuit used in digital devices to store data temporarily or permanently. These semiconductor devices contain millions of tiny transistors and capacitors to hold binary information (0s and 1s) and are categorized as either volatile, losing data when power is removed (like DRAM), or non-volatile, retaining data without power (like Flash memory or ROM).
How Memory Chips Store Data
Transistors:
Memory chips use transistors as on/off switches to represent a binary value, with each state storing a “bit” of information.
Binary Representation:
A group of these bits forms larger units of data, such as numbers, letters, or entire computer instructions.
Capacitors:
In some types of memory, such as Dynamic RAM (DRAM), capacitors are also used to store these binary values.

How is RAM Made?

Have you ever wondered what RAM is made of and how memory is made? Here’s a behind-the-scenes look at the complicated process we go through to create memories to ensure you receive a high-quality product.

Types of Memory Chips?

Memory  made up of four types of memory chips: RAM, ROM, CMOS, and Flash. RAM stands for Random Access Memory and ROM stands for reading Only Memory. They also known as the primary storage of a computer.

Silicon Ingot

The first step from Si to the integrated circuit is producing a cylinder or pure, monocrystalline silicon ingot with a diameter of 330 millimeters. The circuit elements of the chip (electronic transistor, resistors and capacitors) then formed in layers on the silicon wafer. Once assembled, the silicon ingots cut into thin, highly polished wafers less than six millimeters thick. Circuits developed, simulated, and refined in computer systems before they actually built.

Photolithography

In the sterile cleanroom environment, wafers go through a multi-step photolithography process that repeated once for each mask required by the circuit. Masks used  to define the different parts of a transistor, capacitor, resistor, or connector that complete the integrated circuit and  the circuit pattern for each layer in which the device manufactured.

Photoresist

The wafer then evenly coated with a thick, light-sensitive liquid, known as photosensitive resin. Portions of the wafer selected for exposure by carefully aligning a mask between an ultraviolet light source and the wafer. The light passes through the transparent areas of the mask and exposes the photosensitive resin.

save

During the etching step, wet acid or dry plasma gas applied to the wafer in order to remove the part of the nitride layer which not protected by the hardened photosensitive resin. This leaves a pattern of nitride on the pad in the exact design of the mask.

Classification Storage Technologies

Data carriers can be classified according to many functional criteria. Among these, silicon-based semiconductor memories divided into two: volatile and non-volatile In volatile memories. Information will eventually fade when the power turned off, unless the devices to store the data regularly updated.

On the other hand, non-volatile memories retain the stored information even when the power turned off. Volatile memories, such as static random contact memories (SRAM) and dynamic random access memories (DRAM), require a power supply to store their information, while nonvolatile memories,  Flash memories keep their information without.